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ECE 627. Packaging for Electronics. 3 Credits.
Processes and materials for packaging of electronic components and devices, including integrated circuit chips, chip packages, and board level packaged systems; boards and substrates technology; quality and reliability of electronic packages. Open to all engineering majors. Cross-listed with IME 627. {Also offered for undergraduate credit - see ECE 427.}.
Materials and Nanotechnology
http://catalog.ndsu.edu/programs-study/graduate/materials-nantechnology/
...Electromagnetic Theory 3 ECE 751 Electromagnetic Theory and Applictions 3 IME 627 Packaging for Electronics...