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IMEĀ 627. Packaging for Electronics. 3 Credits.

Processes and materials for packaging of electronic components and devices, including integrated circuit chips, chip packages, and board level packaged systems; boards and substrates technology; quality and reliability of electronic packages. Open to all engineering majors. Cross-listed with ECE 627. {Also offered for undergraduate credit - see IME 427.}.

Materials and Nanotechnology

...Applictions 3 IME 627 Packaging for Electronics 3 IME 720 Surface Engineering 3 IME 635...